发明名称 Process of forming inter-level connection without increase of contact resistance
摘要 A natural oxide on an amorphous silicon exposed to a miniature contact hole is thermally decomposed in vacuum and an amorphous silicon is grown on the amorphous silicon without exposing to the atmosphere; the amorphous silicon is applied with heat so as to be epitaxially grown on a single crystal silicon beneath the amorphous silicon, thereby forming a conductive plug in the miniature contact hole.
申请公布号 US5930675(A) 申请公布日期 1999.07.27
申请号 US19960632908 申请日期 1996.04.16
申请人 NEC CORPORATION 发明人 HADA, HIROMITSU
分类号 H01L21/28;H01L21/20;H01L21/265;H01L21/285;H01L21/768;(IPC1-7):H01L21/476 主分类号 H01L21/28
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