| 摘要 |
PROBLEM TO BE SOLVED: To provide Cu-Fe-P series copper alloy foil having sufficient strength and electrical conductivity and moreover excellent in productivity. SOLUTION: This foil is the one having a compsn. contg., by weight, 0.05 to 3.5% Fe and 0.01 to 0.4% P, furthermore contg., at need, one or two kinds of 0.05 to 5% Zn and 0.05 to 3% Sn, moreover contg., at need, one or more kinds among Mg, Co, Pb, Zr, Cr, Mn, Al, Ni, Si, In and B by 0.01 to 2% in total, and the balance Cu, in which the dimensions of inclusions are regulated to <=10μm, and also, the number of the inclusions with 5 to 10μm dimensions is regulated to <50 pieces/mm<2> in the cross-section parallel to rolling. It is suitable as a copper alloy foil material high in reliability in use for printed circuit boards and in a semiconductor packaging field such as IC tape carriers.
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