| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. excellent in resistances to moisture and soldering heat by compounding an epoxy resin comprising two resins in a specified ratio with a phenol aralkyl resin, a specified amt. of an inorg. filler, and a cure accelerator. SOLUTION: This compsn. contains, as essential ingredients, an epoxy resin comprising (A) an epoxy resin of formula I (wherein n is an integer of 0 or higher) and (B) an epoxy resin of formula II (wherein R<1> to R<4> are each H or a 1-10C alkyl) in a wt. ratio of A/B of 1-10, a phenol aralkyl resin of formula II (wherein n is an integer of 0 or higher), an inorg. filler in an amt. of 25-93 wt.% of the compsn., and a cure accelerator. In addition to a phenol aralkyl resin, a novolak phenol resin obtd. by reacting a phenol with formaldehyde or paraformaldehyde and a modification thereof may be jointly used. A silica powder having an average particle size of 30μm or lower is pref. as the filler.
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