| 摘要 |
PROBLEM TO BE SOLVED: To suppress temperature increase due to heat from an electronic component test equipment board, and improve the test accuracy by cooling a resistor component mounted on the electronic component test equipment board. SOLUTION: When a pump 13 that supplies cooling liquid is connected to a pipe 7, the cooling liquid supplied from the cooling liquid supplying pump 13 is circulated through a pipe 7, a tube 6 and a cooling liquid flow path in a heat sink 3. Temperature increase is suppressed efficiently through heat dissipation from the heat sink 3 and cooling by cooling water circulation. Also since the pipe 7 is connected by insertion, its length can be freely adjusted and is applicable to various board sizes. Thus, since the temperature increase due to heat from the resistor component mounted on the test equipment board can be suppressed, test accuracy is improved and the life of the board and the mounting component are also increased. |
