| 摘要 |
PROBLEM TO BE SOLVED: To obtain an insulation resin for build up, excellent in handling properties without impairing the maintenance of a film shape, not having a tacky property, and excellent in insulating property and Tg, and to provide methods for producing an insulation resin film for build up and a multilayer printed circuit board by using the same. SOLUTION: This insulation resin for build up is obtained by performing a pre-reaction of an acrylonitrile-butadiene rubber with its curing agent, and blending the pre-reacted material with an insulation resin material. The insulation resin for build up is molded to a film shape and used as an insulation resin film for build up. Further, a multilayer printed circuit board is produced by forming an insulation layer by the insulation resin film for build up on a first circuit formed on an insulation preform, forming connecting holes on the insulation layer with a laser processing, forming a second circuit on the insulation layer and also connecting the first and second circuits through the connecting holes. |
