| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of short circuit fault by forming a clearance between a connecting electrode and a permanent solder resist, and arranging the level of the character on the permanent solder resist layer lower than that of the connecting electrode. SOLUTION: This printed board is provided with a clearance in the range of 50-200μm, between a section where a character 4 is put together with a permanent solder resist 3, and a connecting electrode 6, whereby solder cream can easily flow into the clearance between the permanent solder resist 3 and the connecting electrode 6 when melted in a reflow furnace, which can prevent the occurrence of a solder bridge, etc. The level of the permanent solder resist is arranged to be higher than that of the connecting electrode. Furthermore, the character 4 face on the permanent solder resist 3 is made in roughly flat condition so that it can support mounted fixed electronic parts in roughly parallel conditions. Such matter can be prevented that the electrode of the mounted electronic parts is mounted in a state of being lifted above the solder cream on the connecting electrode, and the reliability on quality can be raised.
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