| 摘要 |
<p>A system (10) for transporting and inspecting leads of semiconductor devices (12) includes a head (42) for transporting the semiconductor devices (12) from one support structure (14) to a second support structure (16) and wherein two dimensional and three dimensional measurements of the positional accuracy of the leads is carried out during the transport process. The inspection apparatus (50) is interposed in the transport path (31) and includes a first optical sensor (60) oriented to capture a two dimensional image of the semiconductor device package (12) and compare the image with a predetermined two dimensional image stored in a central processing unit (CPU). A high intensity light source (70) generates a plane of light which is reflected off of the semiconductor device leads to a second optical sensor (65) wherein a so-called three dimensional image is generated to be compared by the CPU with predetermined or calculated positional relationships of the leads to establish coplanarity of the lead tips, or lack thereof.</p> |
