| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module having a high joining strength, a high heat conducting property, and a long service life. SOLUTION: In a semiconductor module, the occurrence of such a problem that, the joining strength between a chip mounting surface 5 and a heat radiating member 7, such as the heat sink, etc., is deteriorated by thermal stresses, is reduced as compared with the conventional example, because the substrate 5 is press-contacted with the member 7 in a finely displaceable state by using an elastic pressing member 12, and the substrate 5 and member 7 can freely expand and shrink even when a difference exists between the coefficients of thermal expansion of the substrate 5 and member 7. Since the substrate 5 is press-contacted with the member 7 through heat-conductive grease, in addition, a high heat radiating property can be secured. |
