| 摘要 |
PROBLEM TO BE SOLVED: To improve a radiation property, and to easily remove a heat sink on disassembly. SOLUTION: At the upper-surface part of an IPM 12 (intelligent power module) that has an inverter circuit and a predrive circuit integrally, a screw 25 is clamped from a lower-surface side for mounting a heat sink 24. The IPM 12 is soldered for mounting by inserting each lead 12a into the through hole of a circuit board 21. At this time, a hole 21a corresponding to the mounting position of the screw 25 is formed on the circuit board 21. The circuit board 21 is accommodated into a case 23, and a potting material 26 is filled so that the entire lead 12a of the IPM 12 is buried. On disassembly, the bottom-wall part of the case 23 is broken by a drill or the like, a driver is inserted from a lower part through a hole 21a of the circuit board 21, and the screw 25 is loosened, then the heat sink 24 can be removed. |
