| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method superior in cutting position accuracy in the cutting method of a multilayer board for cutting each part corresponding to an individual interlayer substrate, by viewing cutting guide marks G by X-rays and positioning a multilayer board manufactured by means of arranging the inner layer substrates. SOLUTION: Two cutting guide marks G installed in inner layer substrates 10a and 10b are viewed for the respective inner layer substrates 10a and 10b by X-rays 36. The end side of the side of a direction A, where the inner layer substrates 10a and 10b are arranged, is cut by a cutting device 30, while the cutting angles of the cutting device 30 are adjusted for the respective inner layer substrates 10a and 10b, in accordance with an angle difference between a direction connecting the two viewed cutting guide marks G for respective inner layer substrates 10a and 10b and a prescribed direction. |
