发明名称 Electronic-part mounting
摘要 <p>A manual electronic-part mounting apparatus includes a manual adhesive coating apparatus, a manual electronic-part fitting apparatus, and a manual printed-wiring-board checking apparatus. The manual adhesive coating apparatus has a pressing plate portion (31) to which a large number of needles (35) are fitted, being arranged such that the needles (35) with the adhesive are brought in contact with a printed-wiring board (50), thereby the adhesive being coated on predetermined positions of the printed-wiring board (50). The manual electronic-part fitting apparatus has a large number of electronic-part supply rods. The electronic-part supply rod has an electronic-part storage rod supported by a fixed plate and an extruding rod supported by a movable plate. When the movable plate is moved relative to the fixed plate, the chip-type electronic part is extruded from an end-portion side aperture of the electronic-part storage rod. <IMAGE></p>
申请公布号 EP0804063(A3) 申请公布日期 1999.12.15
申请号 EP19970302655 申请日期 1997.04.18
申请人 SONY CORPORATION 发明人 SUGIYAMA, OSAMU
分类号 H05K3/34;H05K3/30;H05K13/04;H05K13/08;(IPC1-7):H05K13/04 主分类号 H05K3/34
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