| 摘要 |
PROBLEM TO BE SOLVED: To perform fitting adjustment to the input/output parameter of a connecting part at a lower cost by connecting capacitive elements arranged in a dummy structure with a connection pad, corresponding to output signal characteristic. SOLUTION: In order to fit and adjust the input/output parameter of a connecting surface 1 for a semiconductor integrated circuit to external line and conductor, a part of capacitive elements arranged in a dummy structure is used, e.g. a modular structure for the capacitive elements in the dummy structure is formed. In the dummy structure, parts of the capacitive elements 34,..., 37 are connected with a connection pad 1 via a symbolically shown connecting line 39, corresponding to desired capacitance space factor of the connection pad 1. The connecting line 39 is stretched as a metal conductor path in a wiring plane above a polysilicon section. A separable protective fuse or a switching element is arranged additionally, and after the formation or when necessary, desired capacitance value is adjusted or set during operation of the semiconductor circuit.
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