| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer cleaning and drying device which causes particles in a cleaning solution hard to adhere to wafers, when the wafers are cleaned and pulled up and dried. SOLUTION: A wafer cleaning and drying device 40 is provided with a cleaning bath 42, in which wafers are cleaned with a cleaning solution caused to overflow and a drying bath 14, in which the cleaned wafers are pulled up and dried. The cleaning bath 42 is constituted in a square pipe type top-opened bath such that the top edge of one 44A of vertical walls 44A-44D forming the bath 42 is lower than those of the other vertical walls 4B-4D, so that the cleaning solution is made to be overflowed via the low vertical wall 44A. A nozzle body 46 having many nozzle holes 48 for spraying the cleaning solution in parallel with the surface of the solution toward the wall 44A having the low top edge is extended along the top edge of the wall 44C facing opposite the wall 44A.</p> |
