| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure in which a semiconductor element can be mounted on a substrate with high accuracy in a good state without deteriorating the high-frequency signal transmission characteristic of the element though the structure is based on the flip chip mounting, and, at the same time, which can improve the reliability of the element. SOLUTION: In a mounting structure, a semiconductor element 4 is mounted on a mounting substrate 1 in such a way that a lid substrate 5 carrying a semiconductor element 5 stuck to the central part of its lower surface is placed on the upper surface of a mounting substrate 1 with a plurality of clearance setting members 8 arranged on the outer peripheral section of lower surface of the substrate 5 in between, an electrode pad on the lower surface of a semiconductor element 4 is joined to a connection pad on the upper surface of the substrate 1 through conductor terminals 7, and the lid substrate 5 is joined to the mounting substrate 1 including the clearance setting members 8 with a sealing resin 9. Therefore, the element 4 can be joined to the substrate 1 in a good state without deteriorating the high-frequency signal transmission characteristic of the element 4. It is also possible, in addition, to eliminate the adverse influence of high-frequency noise when electrical conductivity is imparted to the lid substrate 5 and clearance setting members 8. |
