发明名称 |
PROCEDE DE BRASAGE PAR REFUSION DE COMPOSANTS ELECTRONIQUES UTILISANT DES PRE-DEPOTS D'ALLIAGE DE BRASURE ET DISPOSITIF DE BRASAGE POUR LA MISE EN OEUVRE D'UN TEL PROCEDE |
摘要 |
The invention concerns a method for brazing by solder reflow electronic components (22) on a support (20), which consists in: providing a solder alloy which has been subjected to a pre-deposit on the support sites for connecting the components and/or which has been subjected to a pre-deposit on sites/terminations of the components properly speaking; depositing curable glue on the support (20) bonding sites; and carrying out a dry process fluxing of the support by contacting said support with a fluxing atmosphere comprising excited or unstable species substantially free from electrically charged species.
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申请公布号 |
FR2781974(A1) |
申请公布日期 |
2000.02.04 |
申请号 |
FR19980009774 |
申请日期 |
1998.07.30 |
申请人 |
L'AIR LIQUIDE SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE |
发明人 |
CARSAC CLAUDE;CONOR GILLES;SINDZINGRE THIERRY |
分类号 |
B23K1/00;B23K1/008;B23K1/20;H05K3/34;(IPC1-7):H05K3/34;B23K31/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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