| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for satisfactorily maintaining the ability of a device by means of eliminating the occurrence of splash, owing to heat at the time of welding and the restriction of a deposition possible area at the time of collectively covering the packages of a plurality of piezoelectric devices through the use of electron beam welding. SOLUTION: In a piezoelectric device, piezoelectric oscillators are housed in package main bodies 30 provided with recessed parts 31 on upper faces and the openings of the recessed parts in the package main bodies are sealed by a metallic cover 21. It has a structure in which the upper faces of outer frames are scanned with the electron beam, while the metallic covers are pressed to the upper faces 32 of the outer frames in the package main bodies so as to weld them. A plurality of metallic cover connection bodies 20 integrated for collectively covering the openings of the recessed parts in a plurality of package main bodies which are arranged in parallel are used. The metallic cover connection bodies are formed of metallic cover parts, having the area forms of a necessary minimum and connection pieces 22 integrating the respective metallic cover parts. The connection pieces function as members to be pressed at the time of pressing.
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