| 摘要 |
PROBLEM TO BE SOLVED: To obtain a new episulphide compound having a specific structure and more excellent curing property, capable of giving a cured product excellent in balance between moisture resistance and heat resistance and useful as a resin for sealing semiconductor, a resin for laminate or the like. SOLUTION: This new episulphide compound has a chemical structure expressed by formula I [R1-R5 are each H, a halogen, a 1-6C alkyl, or the like; (n) is 0-10; Z1-Z5 are each S or O, at least one of Z1-Z5 is S and the ratio of S/(S+O) is pref. 5-90% based on the total in Z1-Z5]. The compound of formula I is obtained by reacting (A) an epoxy compound of formula II (e.g. an epoxy compound of polyphenol obtained from phenol and salicylaldehyde) with (B) a sulphidizing agent (pref. a thiourea) in the ratio of (1 equiv. epoxy group of constituent A)/(0.05-5 mol constituent B) in a solvent such as tetrahydrofuran pref. at 0-50 deg.C for 0.5-30 h.
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