发明名称 WAFER TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the occupancy space of a wafer treatment device. SOLUTION: A wafer transfer robot suspension, supported to a frame 35 on a ceiling of a wafer treatment device, is used as a wafer transfer mechanism which transfers wafers. The wafer transfer robot comprises a base section 1 suspension supported to the frame 35, a first arm 11 supported by the base section 1 in a turnable state and raising and lowering around a vertical axis, a second arm 12 connected to an end top of the first arm 11 in a state capable of freely turnable around a vertical axis, and a third arm 13 connected to an end top of the second arm 12 in a state of being capable of turning around a vertical axis. The first arm 11, the second arm 12, and the third arm 13 are turned independently by a motor 21, a motor 22, and a motor 23 respectively. The suspension support of the wafer transfer mechanism from the ceiling makes it possible for a space below to be used for the arrangement of the wafer treatment section, its auxiliary facilities, of the like.
申请公布号 JP2000077499(A) 申请公布日期 2000.03.14
申请号 JP19980250072 申请日期 1998.09.03
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 HARA TAKASHI
分类号 H01L21/677;B01J19/00;B25J9/06;B65G49/06;B65G49/07;H01L21/02;H01L21/66;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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