发明名称 ELECTROLESS GOLD PLATING LIQUID
摘要 PROBLEM TO BE SOLVED: To obtain a plating liquid with decreased toxicity which keeps good pattern plating property and which enables stable and thick plating for a long time by adding compds. IIIb, Vb elements to a catalyst-type plating liquid containing gold salts, complexing agent, reducing agent, pH buffer or the like without incorporating cyanide compds. SOLUTION: A catalyst-type electroless gold plating liquid without containing cyanide compds. is prepared by incorporating gold salts such as gold sodium sulfite and sodium chloroaurate by about 1 to 10 g/L calculated in terms of gold ion, complexing agent such as sodium thiosulfate and sodium sulfite by about 5 to 100 g/L, reducing agent such as thiourea by about 0.5 to 5 g/L, and pH buffer such as sodium tetraborate by about 5 to 60 g/L. Further, compds. of IIIb, Vb elements are incorporated as additives by about 1×10-3 to 1 g/L to the plating liquid. The IIIb elements are preferably Ga and In, and the Vb elements are preferably Sb and Bi. The additives produce S ion and insoluble compd. from the sulfite ion to prevent decomposition of the plating liquid or failure in plating precipitation.
申请公布号 JP2000087250(A) 申请公布日期 2000.03.28
申请号 JP19980255895 申请日期 1998.09.10
申请人 HITACHI CHEM CO LTD 发明人 YAMAMOTO HIROSHI;YAMASHITA TOMOAKI;KAMIYAMA KOJI
分类号 C23C18/44;(IPC1-7):C23C18/44 主分类号 C23C18/44
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