| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of the conduction between electrode terminals and connecting pins by subjecting the ridge line parts at the ends of a substrate to chamfering so as to satisfy specific relations. SOLUTION: The ridge line parts at the ends of the substrate are subjected to chamfering so as to satisfy the relation A≈0.28/T when the thickness of the substrate is defined as T and the chamfering quantity in the thickness direction of the substrate as A. With the device, liquid crystals 4 are held into the glass substrates 1 and 2. At least, one ridge lines at the glass ends of the electrode terminals 5 disposed at the glass substrate terminal part of the glass substrate 1 are subjected to fine chamfering 6 by using a diamond wheel, etc. Next, the surfaces of the electrode terminals 5 are printed or coated with a conductive resin 7 and thereafter, connecting pins 15 composed of upper connecting pin clips 8, lower connecting pin clips 9 and connecting pin clip rear surfaces 10 are inserted into the electrode terminals 5. An upper molding material 11 and a lower molding material 12 are applied thereon so as to cover the connecting pins 15.
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