| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of splits and prevent glue of a tape from sticking, by dividing a semiconductor wafer into individual pellets, connecting and fixing the pellets with a wiring board via bumps, and grinding the upper surfaces of the pellets in the state that the pellets and the wiring board are formed in a unified body. SOLUTION: A semiconductor wafer is divided into individual semiconductor pellets P by dicing. A plurality of bumps 20 are formed on the surfaces of the individual pellets. Surfaces on which the bumps 20 are formed are made to face a chip size package(CSP) wiring board 21. The bumps 20 are brought into contact with electrodes formed on the CSP wiring board 21. A plurality of the bumps 20 are bonded to specified electrodes. Sealing is performed by the filling of resin 23, and the pellets P are fixed on the CSP wiring board 21. The upper surfaces 22 of the mounted semiconductor pellets P, i.e., surfaces on which the bumps 20 are not formed are ground in CSP wiring board units by using grinding equipment.
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