| 摘要 |
PROBLEM TO BE SOLVED: To enhance a semiconductor device in productivity by a method, wherein a dummy pattern is formed on a board at the center of a site where an IC is mounted, adhesive agent is applied onto the dummy pattern to serve as an underfill, a bump is bonded to the pattern through eutectic bonding by thermocompression with a bonding head, and the adhesive agent is hardened. SOLUTION: A dummy pattern 6 is formed on the center of a pattern 3 plated with Sn on a board 2 and connected to an IC 1, and an underfill 4 is applied thereon. Then, a camera is moved to a position between the IC 1 chucked by a bonding head 5 and the board 2, the positions of the IC 1 and pattern 3 are calculated through image processing, and correction is made on X, Y, andθby a stage where the board 2 is set. Then, the IC 1 is bonded to the board 2, and the bumps of the IC 1 are connected by eutectic bonding to Sn plating which is provided to the pattern 3. At this point, the underfill 4 is applied in just sufficient an amount to spread in the pattern 6, and the underfill 4 hardens almost independent of temperatures, when the IC 1 reaches close to the pattern 6 with a prescribed interval.
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