发明名称 INSULATION-COATED CONDUCTIVE FINE-GRAIN, ANISOTROPIC CONDUCTIVE ADHESIVE, AND CONDUCTIVE CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide insulation-coated conductive fine-grains which can be applied to finer wiring, which have no problems related to electric capacity at the time of connection to achieve stable connection without causing a leak phenomenon, and which can achieve electric continuity without using a high temperature or a high pressure. SOLUTION: In insulation-coated conductive fine-grains comprising conductive fine-grains of an average grain diameter of 0.5-1000μm, an aspect ratio of less than 2, and a CV value of 30% or less, and a coating layer comprising an insulating resin of a thickness of 1/30000-1/3 of the average grain diameter of the conductive fine-grains formed on the surface of them, the insulating resin does not have autohesion performance or fluidity at a room temperature, its fluidity is increased at it is heated, and its viscosity becomes 10.0000 Pa.s or less at 140 deg.C.
申请公布号 JP2000100249(A) 申请公布日期 2000.04.07
申请号 JP19980270027 申请日期 1998.09.24
申请人 SEKISUI CHEM CO LTD 发明人 SUZUKI TAKUO;UKAI KAZUO
分类号 H01L21/60;B29B9/16;H01B1/00;H01B1/20;(IPC1-7):H01B1/20 主分类号 H01L21/60
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