| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-base BGA(ball grid array) package, which has a circuit formed on a copper foil layer on an insulating layer with heat-resistant thermoplastic resin as essential component, by connecting via-hole upper and lower wires and forming a solder ball in the same process. SOLUTION: Of the metal-base BGA package which has a copper foil layer 25 stacked on a metal sheet as a base across an insulating layer formed of heat-resistant thermoplastic resin as essential component to a thickness of 50μm of less, the heat-resistant resin layer having the copper foil layer 25, etched and exposed at the part corresponding to a via hole 13, is etched by a laser. After the circuit is formed on the copper foil layer, at least the copper foil layer 25 at the periphery of the via hole 13 and the metal sheet part of the via hole 13 are processed through electroless Ni and Au plating. Then a solder ball 200 for the BGA package is mounted and substantially made as tall as the part where there is no via hole 13, and the metal sheet and copper foil wire are connected.
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