| 摘要 |
PROBLEM TO BE SOLVED: To make a wafer hold by a wafer holding part, without hindering in a positioned state of the wafer where a wafer-processing device is provided with a wafer-polishing part and a loading stage for positioning the polishing preceding wafer. SOLUTION: A wafer 28 is made to float, in a state in which the wafer 28 is positioned in a recess 64 by a floating mechanism (a jet hole 68, a feed pump and the like) provided on a loading stage 18 and thereafter, the wafer 28 is provided so that it is made to adsorptively hold by a chuck 90 and the like. Thereby, in a centering state of the wafer 28, the wafer 28 can be made to hold by the chuck 90 and the like without hindrance.
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