| 摘要 |
<p>A pressure sensitive hot melt adhesive is prepared containing a depolymerized elastomeric polymer of relatively low molecular weight, and an elastomeric polymer of relatively high molecular weight as the base polymer blend together with a tackifying resin and a plasticizer. The adhesive which is a semi-liquid at room temperature, may be applied to substrates such as self-adhesive labels at moderate temperatures (260 °F), and after crosslinking with ultraviolet or electron beam radiation gives a pressure sensitive adhesion with good low temperature (-20 °F) as well as room temperature (68 °F) properties.</p> |
