| 摘要 |
PROBLEM TO BE SOLVED: To avoid soldering mounting defect caused by package cracks and swell of a package rear in a solder reflow process when a semiconductor device is mounted on a board, by obtaining high bonding force by bonding sealing resin directly to a rear of a semiconductor element during resin sealing, relaxing stress to sealing resin, and decreasing water amount absorbed by adhesive by decreasing an amount of adhesive used for joining a semiconductor chip and a die pad when a semiconductor chip is mounted on a die pad. SOLUTION: A die pad joining a semiconductor element 10 of a lead frame has an opening in a central part and avoids troubles caused by stress relaxation and heating of soldering, etc. Additionally, heat dissipation property can be also improved by making a die pad of a semiconductor element junction part thicker than a lead part and exposing it outside a package during resin sealing. |
