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发明名称
电极连接片之结构
摘要
本创作系一种电极连接片之结构,其中连接片之连接部系设成水平型态,该连接部并设有环缘呈凹陷状之套接孔,套接孔与开关座电极之接触缘并向脱出方向弧曲弯摺,令套接孔之孔缘形成有弧凹之容置空间,藉之,该连接片系利用水平连接部预设之套接孔套设于开关座之电极,复予实施焊接作业,其中熔化之焊锡乃顺沿电极而流至连接片套接孔孔缘弧凹之容置空间,俟其凝固后,电极则与连接片相导电,适令焊点呈「平整式」型态而无外露之虞者。
申请公布号
TW394474
申请公布日期
2000.06.11
申请号
TW087220470
申请日期
1998.12.09
申请人
华泰电器股份有限公司
发明人
黄李水桃
分类号
H01R4/02
主分类号
H01R4/02
代理机构
代理人
李文祯 台南巿府前路二段二三九号二楼
主权项
1.一种电极连接片之结构,连接片之连接部系设成水平型态,该连接部并对应电极而设有套接孔,该套接孔之环缘形成有凹陷状之容置空间,该套接孔套接于电极时,上述容置空间适位在电极待焊处之周围者。2.如申请专利范围第1 项所述电极连接片之结构,其中套接孔与电极之接触缘系向脱出方向弯摺起者。
地址
台南县新巿乡国际路一号
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