| 摘要 |
PROBLEM TO BE SOLVED: To perform the macro inspection of the whole surface of a wafer. SOLUTION: The peripheral part of a wafer 8 is sucked and held by the tip of the wafer holding part 702 of a wafer holding arm 7 to perform the first observation of the reverse side of the wafer 8. Thereafter, the wafer 8 is delivered onto a center table 6, the center table 6b is rotated by a prescribed angle, and the peripheral part of the wafer 8 is sucked and held by the tip of the wafer holding part 702 of the wafer holding arm 7 to perform the second observation of the reverse side of the wafer 8.
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