发明名称 INSULATION RESIN COMPOSITION AND PRODUCTION OF MULTILAYER PRINTED WIRING BOARD PREPARED BY USING SAME
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition satisfactory both in impact resistance and heat resistance and in flame retardancy and reliability of electrical insulation and excellent in processability for forming fine blind via holes(BVH) with an aqueous alkali solution by mixing an alkali-soluble curable resin composition with a carboxyl-containing oxidizing-agent-soluble elastomer microparticles. SOLUTION: The particle diameter of the elastomer polymer microparticles is below 1μm. The alkali-soluble curable resin composition (A) contains a carboxyl-containing alkali-soluble acrylic polymer and/or methacrylic polymer(B), a polymerizable compound (C) having at least one C-C double bond, an ultraviolet polymerization initiator (D), a sensitizer (E) for ultraviolet polymerization, and a thermal polymerization initiator (F). The mixing ratio is preferably such that the composition contains 5-40 wt.%, based on the entire composition, elastomer microparticles, 10-60 wt.% component B, 10-200 pts.wt., per 100 pts.wt. component B, component C, 0.5-10 pts.wt., per 100 pts.wt. component A, each of components E and E, and 0.5-5 pts.wt. component F.
申请公布号 JP2000186217(A) 申请公布日期 2000.07.04
申请号 JP19980362138 申请日期 1998.12.21
申请人 TOAGOSEI CO LTD 发明人 HARUTA YOICHI;HIRAOKA HIDEKI
分类号 H05K3/46;C08K7/16;C08L101/08;(IPC1-7):C08L101/08 主分类号 H05K3/46
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