| 摘要 |
PURPOSE: A power module is provided to prevent the inferiority of a product and the increase of thermal resistance of a heat sink due to a silicon rubber adhesive. CONSTITUTION: A power module comprises: a heat sink(21) having a top surface and a bottom surface for heat dissipation; a substrate(22) attached to the top surface of the heat sink; a semiconductor chip(23) having the power function attached to a part of the top surface of the substrate; a terminal(24) which acts as an electrical path between the semiconductor chip and the external, being attached to other part of the top surface of the substrate; a wire(25) connecting the semiconductor chip and the terminal electrically; a silicon gel(28) which seals up the semiconductor chip and the wire, being filled in a case(26); and an epoxy resin(29) filled in the top surface of the silicon gel in the case so that, at least, the ended part of the terminal is to be revealed. A plurality of grooves(26b) are formed on an adhesive surface(26a) of a side bottom part of the case attached to an edge(21a) of the heat sink are formed in order for the flow of a silicon rubber adhesive(27) to be guided to the grooves.
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