| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for semiconductor device superior in coplanarity. SOLUTION: A substrate 12, where with a required wiring pattern 13 formed, a semiconductor chip housing hole 15 penetrates in the thickness direction, a heat sink 18 fixed with an adhesive layer to the substrate 12 while covering an opening part of the semiconductor chip housing hole 15 which is opened on a surface opposite to the mounting surface of the substrate 12, and a solder resist layer 19 covering the mounting surface of substrate 12 while a land part where an external connection terminal of a wiring pattern 13a formed on the mounting surface of substrate 12 is formed is exposed, are provided to a semiconductor device package 30. Here, the solder resist layer 19 is formed of a photosensitized resist and a resin layer 32 of resin, whose thermal expansion coefficient which is smaller than the solder resist layer 19 is formed so as to cover the solder resist layer 19.
|
