| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device by which a high-precision plating is obtained at a high speed. SOLUTION: This device in which a material 8 to be treated is held vertically and conveyed in the tank has a conveyor hanger 3 for holding the material and applying a plating current, a plating tank conveying means 13 for suspending the hanger and applying a plating current, a pretreating conveyor 11 for transferring the hanger and a positioning and conveying means 12 for detaching the conveyor hanger from conveyor, transferring the hanger at a higher speed than the plating tank conveying means and mounting the materials on the plating tank conveying means at regular intervals. The tank is conveyed at a definite speed, the interval between the tank and the material previously attached to the plating tank conveying means is kept at such a distance that the plating thickness is kept uniform, the hanger holding the following material is attached to the plating tank conveying means and conveyed, and plating is performed.
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