Thermische Kontrolle von elektronischen Komponenten unter Verwendung von synthetischem Diamant

摘要

This invention relates to thermal management of electronic devices and circuits and, more particularly, to heat-sinked electronic components that employ synthetic diamond. The invention comprises depositing at a first deposition rate, a first layer of synthetic diamond, of relatively high thermal conductivity, then a second layer, at a second rate, of relatively low thermal conductivity.