MANUFACTURE OF SEMICONDUCTOR MECHANICAL MASS SENSOR

摘要

PROBLEM TO BE SOLVED: To provide a manufacture of a semiconductor mechanical mass sensor which prevents stacking of a movable electrode and a fixed electrode when they are being fabricated or used and can improve the yield. SOLUTION: Electrode pads 4c, 5c are formed on an SOI substrate 14 where a single crystal silicon thin film 14b is provided on a single crystal silicon wafer 14a via a silicon oxide film 14c. The single crystal silicon thin film 14b is ground and polished. A mask 15 is formed. A trench 16 is formed in the single crystal silicon thin film 14b so as to reach the silicon oxide film 14c. The single crystal silicon wafer 14a is wet-etched with a predetermined film thickness left. The remaining single crystal silicon wafer 14a is removed by dry-etching. The silicon oxide film 14c is removed by dry-etching and a hydrophobic thin film 17 is deposited on a surface of a movable electrode 10a and a fixed electrode 4b.