| 摘要 |
PROBLEM TO BE SOLVED: To surely perform image recognition while being mounted on a substrate by forming a pin mark on a plastic package at an exposed part on an upper surface of a die pad package. SOLUTION: Almost quadrate die pad 6 and a plurality of outer leads 7 are molded in a plastic package 5 together with a semiconductor chip. The rear surface of the die pad 6 is exposed at the central part on the upper surface of the package 5 and terminal parts of the outer leads 7 are exposed at the periphery of the bottom surface of the package 5. Marking of product names, product types or the like is made by laser and so on by using the periphery of die pad 6 on the upper surface of the package 5 as a mark indicating part 8, and further a pin mark 9 which is constituted of a plastic mold is formed at the rear terminal part of the die pad 6 exposed on the upper surface of the package 5.
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