| 摘要 |
PROBLEM TO BE SOLVED: To obtain high quality chips at high productivity by a method, wherein appropriate dicing direction for a wafer is actually comprehended by a preliminary trial cutting, prior to a processing. SOLUTION: When kerfs mutually perpendicular are cut by a dicing blade to dice a wafer into small cubes, at the start of dicing processing, a first kerf is chopped up crossing a surface of the wafer, and a second kerf is chopped up at an interval relevant to the first kerf and small cube and in a crossing direction in the parallel and reverse direction. These first and second kerfs are subjected to image processing, so that respective chipping characteristics are inspected visually, and according to the crossing direction of any of the first and second kerfs which is determined that the chipping characteristic is relatively satisfactory by this visual inspection, all the remaining kerfs are cut. |
