| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesion between a through-hole inside-wall and a filler b forming a rough layer on a conductor surface and the through-hole inside-wall of a printed wiring board. SOLUTION: A penetration hole for forming a through-hole is formed by drilling on a glass epoxy copper-plated laminated substrate 1, then the substrate 1 is activated for electroless copper plating and electrolytic copper plating to form a through-hole 3. The substrate 1, where the through hole 3 is formed, is acid-degreased for soft-etching before process in a catalyst solution of palladium chloride, and organic acid, a Pd catalyst is applied for activation before plating in an electroless plating bath, and a rough layer 4 of Cu, Ni-P alloy is formed on the through-hole 3 inside wall and the copper pattern. Thus, the occurrence of crackings or penetration of plating process liquid, etc., is suppressed. |
