| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is constituted in such a way that the manufacturing cost of the BGA package substrate of the device can be reduced significantly while a necessary wiring function is secured, and a method for manufacturing the device. SOLUTION: The BGA package substrate of a semiconductor device is provided with a plain wiring section 2a formed on a semiconductor chip mounting area on the surface of the package substrate, solder ball connecting sections 2c formed at the positions corresponding to the positions to which solder ball terminals on the rear surface of the package substrate are connected on the surface of the package substrate, and a single substrate wiring layer containing connecting wiring sections 2b which are formed to electrically connect one ends of bonding wires to the solder ball connecting sections 2c or the plane wiring section 2a and between other nodes. |
