发明名称 THERMOSETTING PHENOL RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting phenol resin composition and a molding material scarcely generating ammonia or an amine-based gas at the time of molding. SOLUTION: This composition is obtained by compounding 100 pts.wt. of a thermosetting phenol resin with 1-100 pts.wt. of a phosphoric acid compound, 0-30 pts.wt. of a sulfuric salt and 0-30 pts.wt. of titanium dioxide. The molded material is prepared by compounding the composition with a curing agent, a substrate, etc.
申请公布号 JP2000302944(A) 申请公布日期 2000.10.31
申请号 JP19990110178 申请日期 1999.04.16
申请人 GUN EI CHEM IND CO LTD 发明人 YAMAZAKI MICHITO;TAIHICHI SACHIKO;OGURA KAZUHIRO;YANAI MAYUMI
分类号 C08L61/06;C08K3/22;C08K3/30;C08K3/32;(IPC1-7):C08L61/06 主分类号 C08L61/06
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