| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-sized semiconductor device, which is provided with a rigidity and a flatness which are important as characteristics being requiring to an interposer and morevoer, has a long-period reliability, at low cost. SOLUTION: This device 10 has an integrated circuit chip 11 with a plurality of electrode pads 13 provided on the outer peripheray or center part of its circuit formation surface, a lead frame 16, which is electrically connected with the respective electrode pads 13 via connection terminal lead parts 14 on the surface on one side of its surfaces and is provided with a plurality of conductor leads 15 having external connection terminal land parts 19 on the other surface, an interposer 12, which is pasted on at least the back side surface of the lead frame 16 excluding the formation regions of the lead parts 14, has apertures to make the land parts 19 expose and contains a photosensitive insulating resin 20, a sealing resin 23 for sealing one part or the whole of the chip 11 including the lead parts 14 and solder balls 21 provided on the respective land parts 19.
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