发明名称 IMAGE PICKUP DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an image pickup device which can simplify its manufacturing process. SOLUTION: An image pickup device is constituted, in such a way that address electrodes 120 are formed on a substrate 110, so that the electrodes 120 may be arranged in a straight line at prescribed intervals. An organic FL (electroluminescence) layer 130, the part of which emits light when a voltage is impressed upon the part, is formed on the electrodes 120. Then a common electrode 140 is formed on the layer 130, and a data electrode 150 is formed adjacently to the address electrodes 120 on the substrate 110, by using the same material as that used for forming the electrodes 120. In addition, a PC (photoconductive) layer 160, the part of which changes in resistance value, when the light emitted from the organic EL layer 130 and reflected by an object the image of which is to be picked up is made incident to the part, is formed on the data electrode 150. Moreover, a counter electrode 170 is formed on the PC layer 160, by using the same material as that used for the formation the common electrode 140.
申请公布号 JP2000341472(A) 申请公布日期 2000.12.08
申请号 JP19990150724 申请日期 1999.05.28
申请人 CASIO COMPUT CO LTD 发明人 YAMADA HIROYASU
分类号 H01L27/146;H01L51/50;H04N1/028;H04N5/335;H04N5/369;H05B33/00;(IPC1-7):H04N1/028 主分类号 H01L27/146
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