| 摘要 |
PROBLEM TO BE SOLVED: To improve cooling efficiency of electronic components by radiating the heat generated from the electronic components through cooling parts by reducing the volumes of voids in solder by fixing the electronic components and cooling parts to each other in a pressurizing atmosphere, in a state where the electronic parts and cooling parts are brought into contact with each other via molten solder, and then returning the parts to the atmosphere. SOLUTION: At attaching of cooling parts 100 to electronic components 106 mounted on a substrate 104 by soldering, the parts 106 and 100 are brought into contact with each other via molten solder 110 and 112 and fixed to each other in a pressurizing atmosphere, and then the parts 106 and 100 are returned to the atmosphere. Since the solder 110 and 112 are in molten states in the pressurizing atmosphere, when the parts 100 are attached to the parts 106 in this way, the pressure in a chamber becomes higher than the pressure of helium gas enclosed in the solder 110 and 112, even if the helium gas is enclosed in the solder 110 and 112. Therefore, the sizes of voids formed in the solder 110 and 112 can be reduced, because the helium gas enclosed in the solder 110 and 112 is crushed out, due to the pressure difference between the pressure in the chamber and that of the gas.
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