| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of cracks on a package, even when the thickness of the molding resin, ranging from the fringe of a built-in substrate to the outside surface of a sheathing member, is thinned off, and to obtain a small- sized and highly reliable resin-molded electronic component. SOLUTION: A pulse transformer main body 10 is mounted on a printed substrate 1 as an electronic component element, and a sheathing member 30 covering the printed substrate 1, and a pulse transformer main body 10 is formed through resin molding. In this case, the printed substrate 1 has a plurality of notched parts, the resin constituting the sheathing member 30 enters into the notched part, and the upper resin part and the lower resin part are connected against the printed substrate via the notched part.
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