发明名称 HEAT CONDUCTIVE MATERIAL AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To obtain a heat conductive material, which is possessed of an excellent restoring force, high in thermal conductivity, and easily manufactured by a method where silicone rubber filled with thermal conductive filler is modified, so as to have a satisfactory restoring force. SOLUTION: Silicone rubber, filled with a thermal conductive filler and organic synthetic rubber (e.g. EPDM), whose SP value is smaller or larger than that of silicone rubber by 1 or less and which is preferably filled with thermal conductive filler, is kneaded together and formed into a thermal conductive material. Silicone rubber and organic synthetic rubber can be kneaded well without using a large amount of additive oil, and the obtained thermal conductive material has the same satisfactory restoring force as with organic synthetic rubber and is superior in flexibility as silicone rubber and superior in mechanical properties. Furthermore, this thermal conductive material can be molded easily, even if a large amount of filler is added.
申请公布号 JP2000353771(A) 申请公布日期 2000.12.19
申请号 JP19990162613 申请日期 1999.06.09
申请人 KITAGAWA IND CO LTD 发明人 YAMAGUCHI AKIO;KAWAGUCHI YASUHIRO;SUKEOKA TERUAKI
分类号 H01L23/373;C08L23/16;C08L83/00;C08L83/04;(IPC1-7):H01L23/373 主分类号 H01L23/373
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