Camera module and method for the production thereof

摘要

A camera module including an objective lens housing with an optical system, an image sensor chip with wire bonding connections, and a printed circuit board for contacting the image sensor chip. The printed circuit board is designed with wire bonding areas to which the wire bonding connections of the image sensor chip are connected, and the assembly made up of the image sensor chip and the printed circuit board is designed in such a manner that the image sensor chip is focus-adjusted to the optical system by changing its position relative to the printed circuit board taking advantage of the flexibility of the wire bonding connections of the image sensor chip. The invention further relates to a method of manufacturing the camera module.

主权项

1. A camera module comprising:
an objective lens housing with an optical system, an image sensor chip with wire bonding connections, and a printed circuit board for contacting the image sensor chip,wherein
the printed circuit board has wire bonding areas to which the wire bonding connections of the image sensor chip are connected,and
an assembly comprising the image sensor chip arranged on a chip support and the printed circuit board, wherein the assembly is designed in such a manner that the image sensor chip is focus-adjusted to the optical system by changing the position of the image sensor chip and chip support relative to the printed circuit board taking advantage of the flexibility of the wire bonding connections of the image sensor chip, andwherein a support plate is provided, which has a recess adapted to a contour of the chip support and is arranged on the printed circuit board while the chip support is received within the recess.