| 摘要 |
PROBLEM TO BE SOLVED: To obtain a small, lightweight wiring circuit board having high density wiring by providing a wiring circuit, where a conductor pattern is provided on an insulating board, with a wiring circuit having a relatively thin conductor and a wiring circuit having a relatively thick conductor. SOLUTION: Wiring 2, 4 of conductor pattern designed from an electric circuit diagram is provided on a circuit board 3, e.g. a glass epoxy resin board 3 of insulating material. The wiring 2 is a circuit of relatively low current of several mA, e.g. a signal circuit, in the electric circuit diagram and a CPU (central controller) or a gate array circuit is constituted with wiring of conventional line width (or thinner). Wiring 4 for supplying a relatively high current (3A through 10A) for power supply circuit, for example, is formed thicker than the line width thus satisfying the current capacity. The line width may be made thinner, as required. |
