SHEET FOR SEALING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a sheet for sealing semiconductor element which can reduce excess resin and can obtain a thin semiconductor device in accordance with the thinning of a package. SOLUTION: In a semiconductor element sealing sheet, a resin composition layer 2 constituted of epoxy resin composition containing (A) epoxy resin, (B) hardener, and (C) micro capsule containing curing accelerator which has core/ shell structure where a core constituted of curing accelerator is coated with a shell constituted of thermoplastic resin components is formed on a base material face constituted of a heat resistant organic film 1.