| 摘要 |
PROBLEM TO BE SOLVED: To detect only fatal defects out of actual defects and predict the yield of products. SOLUTION: A defect of a wafer which is being manufactured is detected by a defect inspecting apparatus. An image containing the defect is prepared in the form of dots, thereby detecting the feature of the defect. In this defect feature, regions where the same pattern is repeatedly formed are overlapped, whereby a dot map of the defect is formed. Further, whether the product performance is good or not is measured from defects of a finished wafer, whereby a fail map is formed. Then, using the dot map and the fail map, whether or not the product performance of the wafer is good or not is investigated, whereby a neutral network model for predicting defects is constructed. The yield of products can be predicted by this model and the like. Further, critical process steps causing defects are extracted.
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