| 摘要 |
PROBLEM TO BE SOLVED: To process more thinly than the thickness of manufacturing limit by a method, wherein after a polished quartz plate is wet-etched from one face to remove a prescribed thickness, it is dry-etched and again polished by a both-face processing machine. SOLUTION: A polished quartz plate is chemically wet-etched from one face, or etched with reactive ions, to remove about a few tens ofμm. After that, it is chemically dry-etched and is again polished by a both-face polishing machine or a one-side polishing machine, or by other polishing means. Thus, a quartz oscillator can be made thin, a quartz resonator, or the like with high accuracy, and to manufacture readily as a policy the quartz oscillator and the quartz resonator which can oscillate at a few tends of GHz or highes by fundamental waves.
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